Machining of a Semiconductor Show Part on the DMU 60 eVo 2nd Generation

Enjoy the new DMU 60 eVo 2nd Generation by DMG MORI working a state of the art semiconductor show part.
With optimized table kinematics and an advanced gantry design, this 5-axis CNC machine ensures maximum rigidity, accuracy, and long-term stability. With integrated mill-turn machining, gear hobbing (gearSKIVING), and grinding, the DMU 60 eVo 2nd Generation is a true multifunctional machining solution – built for the future of semiconductor manufacturing.

Semiconductor show part
• Material: AlMg4,5Mn
• Size 400 mm x 400 mm x 400 mm
• 16 tool changes
• Process time: 125 min.
• Programming time: 35 hours

Technical Highlights DMU 60 eVo 2nd Generation:
• 3 linear guides in the Y-axis for maximum stability
• Direct-driven ball screws & linear drives for up to 80 m/min rapid traverse
• Dynamic 5-axis simultaneous machining with a swivel-rotary table (-5° / +110°)
• Large working area: Ø 700 x 550 mm, max. 500 kg workpiece weight
• Spindle options up to 40,000 rpm or 200 Nm torque
• Chip-to-chip time: just 4.5 seconds
• Modular tool magazine: 30 / 60 / 120 tools (expandable up to 300)
• Numerous automation solutions for 24/7 productivity
• Modern control options: SINUMERIK ONE & HEIDENHAIN TNC 7 on CELOS X