🥇📀💫長知識了！您知道芯片是如何製作出來的嗎？關注我（ #新瑞大視野），每天更新，讓您瞭解更多精彩內容😄🤝👍 👉 #科技工藝

How does sand become a chip? This is a pile of sand. Pour the sand into the food processor to melt at a high temperature. Then get the liquid nitrogen. Then put the alkali in the liquid nitrogen. The liquid nitrogen will slowly crystallize around the alkali. When you keep pulling, the liquid nitrogen will continue to crystallize. Therefore, a straight line is drawn. The purity of the rule is extremely high, up to 11.9. Then, according to the need, Cut the rule into 0.5 to 1.5 mm silicon balls. Because the surface of the silicon ball is not flat, So it still needs to be cast on the ball. After completion, a qualified silicon ball is formed. Next, we can make the chip. First, it needs to be oxidized. Cover the surface of the ball with a layer of oxidized silicon. Then apply a layer of oxidized silicon on the oxidized silicon. Finally, use the rotation layer technology Apply the optical glue evenly to the oxidized silicon. The next step is the optical process. This is also the most difficult step in chip making. Because it needs to use an optical processor. The optical processor is very difficult to make. But the principle of optical processing is very simple. Use ultraviolet light to illuminate the eyepiece with a circuit diagram. The circuit diagram on the eyepiece is like this. Then the ultraviolet light is focused on the bottom of the silicon ball through the optical chip. Therefore, the circuit diagram on the eyepiece is carved on the optical glue of the silicon ball. The ultraviolet light is carved back and forth. A piece of silicon can carve hundreds of identical circuit diagrams. We zoom in on the silicon ball and we can see The optical glue exposed under the ultraviolet line is solidified. That is, the light blue square. And the gray part is not illuminated by the ultraviolet light. Then the optical glue in these places needs to be processed. How to deal with it? We need to use a silica gel to cover the surface of the silicon ball. When we zoom in on the silicon ball, we can see The gray area that is not illuminated by the ultraviolet light. The optical glue has been removed by the silica gel. The green egg-like layer below the optical glue is exposed. Then the green egg-like layer is also corroded. The lowest layer of the silicon ball is exposed. Then through cleaning, the light blue optical glue layer is removed. The next thing to do is the silicon ball that needs to be exposed to the outside before 10 o'clock. Then apply a layer of uniform ionized silicon. Then put the silicon ball into the time machine for 10 minutes. After 10 minutes, the ionized layer and the uniform layer are all removed by 10 minutes. Leave the area we need. Then we need to do the lithium ionization in these square squares. In order to protect the yellow area that does not need to be mixed. At this time, we need to apply a layer of optical glue on the surface of the silicon ball. Also use optical and silica technology to expose the area we need. The area that does not need to be mixed is covered with optical glue. After completion, lithium ionization can be done. Lithium ionization is mainly mixed. For example, the common p-n bond. When lithium ion is injected into the surface of the silicon ball, an N-shaped semiconductor is formed. When lithium ion is injected into the surface of the silicon ball, a P-shaped semiconductor is formed. Then put them together. This is the p-n bond. After the lithium ionization is completed, the optical glue can be removed. Observe the mixed area. You can see that the conductivity of these areas has been changed. After these steps, a simple crystal tube is carved out. It's not over yet. Next, we need to conduct electricity. To increase the electrical performance of the chip. We use one of the crystal tubes as an example. Through the electric process. Sink the copper ions to the crystal tube. Then apply a layer of metal copper film on the surface of the crystal tube. Then throw away the excess copper. Form a very flat crystal surface. Here we have made all the crystal tubes. Now what we need to do is to connect these crystal tubes together. This needs to be metalized. Through the process of electromagnetic evaporation or construction of dust. Metal circuits are formed on the crystal tube. These metal circuits are interspersed. Four through eight. In the end, a very complex electronic traffic information network is formed. On a chip of the size of a fingernail. There can be more than one hundred million crystal tubes. Then cut the made gold and silver. And seal. When sealing. We need to connect the nodes on the chip. To the silver corner of the sealed shell with a guide line. Finally, cover the protective shell. Here. A complete chip is made. What you need to pay attention to is. The entire chip manufacturing process is extremely complicated. The manufacturing process is operated at the level of nanometers. And the entire manufacturing process is more than hundreds. This video greatly simplified the entire process.