KWL 12" Wafer 邊拋機(Edge Polishing Machine)

- 使用於12吋Wafer,可針對Wafer邊緣三個角度進行研磨
- 可依客戶需求設計傳動方式，降低成本(本設備使用氣缸帶動)
- 客製化的人機介面
- 可設定10道製程並可選擇單向或雙向研磨
- 記錄研磨片研磨次數
- 研磨液PH值檢測

- Using for 12-inch Wafer. Grinding three angles of Wafer edge.
- Customized interface of PLC.
- The grinding direction is available to choose one-way or mutual direction.
- Recording the grinding times of the grinding sheets.
- PH value detection of the slurry.