Pat Gelsinger on the Universal Chiplet Interconnect Express (UCIe)

At Intel Innovation 2022, Pat Gelsinger explains how #Intel helped form the Universal Chiplet Interconnect Express (UCIe) consortium “to create an open chiplet ecosystem.” More than 80 companies in the #semiconductor industry have joined to make an open chiplet interface a reality, including TSMC and Samsung. #IntelON

About Intel Newsroom
Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Catch up on the latest innovations in client computing, artificial intelligence, security, data centers, international news and more. Watch recaps and replays from industry events where Intel has a major role, such as Mobile World Congress (MWC), Intel Innovation, the Consumer Electronics Show (CES) and others.